Preparation and properties of room temperature curing epoxy adhesive used in wide range of temperature

被引:0
|
作者
Lu, Mingchang [1 ]
Yang, Jiping [1 ]
Huang, Pengcheng [1 ]
Zhao, Feifei [1 ]
机构
[1] Key Laboratory of Aerospace Advanced Materials and Performance, School of Materials Science and Engineering, Beihang University, Beijing,100191, China
关键词
Tensile strength - Temperature - Curing - Toughness - Glass - Glass transition;
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:113 / 117
相关论文
共 50 条
  • [41] Preparation and properties of high damping and wide-temperature-range CIIR composites
    Ding, G.-F., 2013, Chinese Vibration Engineering Society (32):
  • [42] CARBOXYL-TERMINATED POLY(PROPYLENE GLYCOL) ADIPATE-MODIFIED ROOM-TEMPERATURE CURING EPOXY ADHESIVE FOR ELEVATED-TEMPERATURE SERVICE ENVIRONMENT
    ACHARY, PS
    GOURI, C
    RAMASWAMY, R
    JOURNAL OF APPLIED POLYMER SCIENCE, 1991, 42 (03) : 743 - 752
  • [43] Tribological Performance of Epoxy/Polyurethane Composites at a Wide Temperature Range
    Lei X.
    Qi H.
    Gu J.
    Yu J.
    Surface Technology, 2024, 53 (07): : 64 - 84
  • [44] THE POLYMERIZATION AND LONG-TERM STABILITY OF ROOM TEMPERATURE CURING EPOXY RESINS
    STEELE, DV
    SPE TRANSACTIONS, 1963, 3 (01): : 61 - 66
  • [45] Preparation and Curing Behaviour of Epoxy Based Film for Moderate Temperature Prepreg
    Yao, Jiangwei
    Zhan, Haihua
    Zou, Zhuanyong
    POLYMERS & POLYMER COMPOSITES, 2017, 25 (08): : 621 - 625
  • [46] FAST CURING EPOXY-EPISULFIDE RESIN FOR USES AT ROOM-TEMPERATURE
    KU, WS
    BELL, JP
    ACS SYMPOSIUM SERIES, 1983, 221 : 153 - 169
  • [47] FAST CURING EPOXY-EPISULFIDE RESIN FOR USE AT ROOM-TEMPERATURE
    KU, W
    BELL, JP
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1982, 183 (MAR): : 106 - ORPL
  • [48] Epoxy - clay nanocomposites - effect of curing temperature in mechanical properties
    Mohan, T. P.
    Kanny, K.
    Velmurugan, R.
    INTERNATIONAL JOURNAL OF PLASTICS TECHNOLOGY, 2009, 13 (02) : 123 - 132
  • [49] VISCOELASTIC PROPERTIES OF THERMOSETTING RESIN ADHESIVES AND THEIR ADHESIVE STRENGTHS OVER A WIDE TEMPERATURE-RANGE
    YAMADA, M
    TAKI, K
    MOKUZAI GAKKAISHI, 1991, 37 (06): : 529 - 534
  • [50] VISCOELASTIC PROPERTIES OF A ROOM-TEMPERATURE CURING DIMETHACRYLATE RESIN
    WHITING, R
    JACOBSEN, PH
    JOURNAL OF MATERIALS SCIENCE, 1985, 20 (03) : 929 - 934