Preparation and properties of room temperature curing epoxy adhesive used in wide range of temperature

被引：0
|
作者：
Lu, Mingchang [1 ]
Yang, Jiping [1 ]
Huang, Pengcheng [1 ]
Zhao, Feifei [1 ]
机构：
[1] Key Laboratory of Aerospace Advanced Materials and Performance, School of Materials Science and Engineering, Beihang University, Beijing,100191, China
来源：
Gaofenzi Cailiao Kexue Yu Gongcheng/Polymeric Materials Science and Engineering | 2014年 / 30卷 / 12期
关键词：
Tensile strength - Temperature - Curing - Toughness - Glass - Glass transition;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：113 / 117
相关论文
共 50 条
  • [1] Study on preparation and properties of a room temperature fast curing epoxy resin nano-adhesive
    Ma, S. N.
    Zhu, N. S.
    Li, C. Q.
    Hu, C. H.
    SURFACE ENGINEERING (ICSE 2007), 2008, 373-374 : 662 - 665
  • [2] Research on Rheological Properties of Room-Temperature Curing Epoxy Adhesive
    Li, Hui
    Luo, Yingshe
    Xie, Jianjun
    Chen, Shengming
    ADVANCES IN CIVIL INFRASTRUCTURE ENGINEERING, PTS 1 AND 2, 2013, 639-640 : 354 - 358
  • [3] Preparation and Properties of Epoxy Adhesives with Fast Curing at Room Temperature and Low-Temperature Resistance
    Liu, Tantan
    Chen, Zeyuan
    Ma, Yuting
    Ren, Yaping
    Tan, Jihuai
    Cheng, Zhenshuo
    Zhu, Xinbao
    ACS OMEGA, 2024, 9 (20): : 22186 - 22195
  • [4] Synthesis and properties of waterborne epoxy curing agent with toughness curing at room temperature
    College of Chemical and Energy Engineering, South China University of Technology, Guangzhou 510640, China
    Gaofenzi Cailiao Kexue Yu Gongcheng, 2006, 1 (52-55):
  • [5] Preparation and characterization of fast-curing powder epoxy adhesive at middle temperature
    Xu, Jie
    Yang, Jiayao
    Liu, Xiaohuan
    Wang, Hengxu
    Zhang, Jingjie
    Fu, Shenyuan
    ROYAL SOCIETY OPEN SCIENCE, 2018, 5 (08):
  • [6] ROOM-TEMPERATURE CURING OF CTBN-TOUGHENED EPOXY ADHESIVE WITH ELEVATED-TEMPERATURE SERVICE CAPABILITY
    ACHARY, PS
    LATHA, PB
    RAMASWAMY, R
    JOURNAL OF APPLIED POLYMER SCIENCE, 1990, 41 (1-2) : 151 - 162
  • [7] Silicon Hybridization for the Preparation of Room-Temperature Curing and High-Temperature-Resistant Epoxy Resin
    Rong, Liping
    Su, Jiaqi
    Li, Zhiguo
    Liu, Xiaohui
    Zhang, Dayong
    Zhu, Jinhua
    Li, Xin
    Zhao, Ying
    Mi, Changhong
    Kong, Xianzhi
    Wang, Gang
    POLYMERS, 2024, 16 (05)
  • [8] Room temperature curing of CTBN-toughened epoxy adhesive with elevated temperatur service capability
    Achary, P.Sasidharan, 1600, (41): : 1 - 2
  • [9] Rheological properties of epoxy oligomers and their mixtures in a wide temperature range
    L. M. Amirova
    K. A. Andrianova
    M. M. Ganiev
    M. A. Ziganshin
    L. R. Amirova
    Russian Chemical Bulletin, 2014, 63 : 247 - 251
  • [10] Rheological properties of epoxy oligomers and their mixtures in a wide temperature range
    Amirova, L. M.
    Andrianova, K. A.
    Ganiev, M. M.
    Ziganshin, M. A.
    Amirova, L. R.
    RUSSIAN CHEMICAL BULLETIN, 2014, 63 (01) : 247 - 251
12345