Delamination in a class of generalized plastic IC packaging materials due to thermal load and moisture

被引：0

|

作者：

Li, Zhi-Gang ^{[1
]}

Shu, Xue-Feng ^{[1
]}

机构：

[1] Institute of Applied Mechanics and Biomedical Engineering, Taiyuan University of Technology, Taiyuan 030024, China

来源：

Gongneng Cailiao/Journal of Functional Materials | 2012年 / 43卷 / 22期

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摘要：

11

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页码：3175 / 3179

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