Delamination in a class of generalized plastic IC packaging materials due to thermal load and moisture

被引：0
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作者：
Li, Zhi-Gang [1 ]
Shu, Xue-Feng [1 ]
机构：
[1] Institute of Applied Mechanics and Biomedical Engineering, Taiyuan University of Technology, Taiyuan 030024, China
来源：
Gongneng Cailiao/Journal of Functional Materials | 2012年 / 43卷 / 22期
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摘要：
11
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页码：3175 / 3179
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