Thermoelectric characteristics and tensile properties of Sn-9Zn-xAg lead-free solders

被引：25
|
作者：
Department of Materials Science and Engineering, National Cheng Kung University, Tainan, 701, Taiwan [1 ]
机构：
来源：
J Alloys Compd | 2006年 / 1-2卷 / 193-198期
关键词：
Soldering alloys;
D O I：
10.1016/j.jallcom.2005.11.011
中图分类号：
学科分类号：
摘要：
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