Thermoelectric characteristics and tensile properties of Sn-9Zn-xAg lead-free solders

被引：25
|
作者：
Department of Materials Science and Engineering, National Cheng Kung University, Tainan, 701, Taiwan [1 ]
机构：
来源：
J Alloys Compd | 2006年 / 1-2卷 / 193-198期
关键词：
Soldering alloys;
D O I：
10.1016/j.jallcom.2005.11.011
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [1] Thermoelectric characteristics and tensile properties of Sn-9Zn-xAg lead-free solders
    Hung, Fei-Yi
    Wang, Chih-Jung
    Huang, Sung-Min
    Chen, Li-Hui
    Lui, Truan-Sheng
    JOURNAL OF ALLOYS AND COMPOUNDS, 2006, 420 (1-2) : 193 - 198
  • [2] Microstructure and tensile properties of Sn-9Zn-xAg lead-free solder alloys
    Song, JM
    Lan, GF
    Lui, TS
    Chen, LH
    SCRIPTA MATERIALIA, 2003, 48 (08) : 1047 - 1051
  • [3] Thermal properties and interfacial reaction between the Sn-9Zn-xAg lead-free solders and Cu substrate
    Chang, TC
    Wang, MC
    Hon, MH
    METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2005, 36A (11): : 3019 - 3029
  • [4] Thermal properties and interfacial reaction between the Sn-9Zn-xAg lead-free solders and Cu substrate
    Tao-Chih Chang
    Moo-Chin Wang
    Min-Hsiung Hon
    Metallurgical and Materials Transactions A, 2005, 36 : 3019 - 3029
  • [5] Microstructure and adhesion strength of Sn-9Zn-xAg lead-free solders wetted on Cu substrate
    Chang, Tao-Chih
    Chou, Shih-Min
    Hon, Min-Hsiung
    Wang, Moo-Chin
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2006, 429 (1-2): : 36 - 42
  • [6] Solid-state reactions at the Sn-9Zn-xAg lead-free solders/Cu interface
    Chang, TC
    Hon, MH
    Wang, MC
    ELECTROCHEMICAL AND SOLID STATE LETTERS, 2003, 6 (06) : C82 - C84
  • [7] Electrochemical behaviors of the Sn-9Zn-xAg lead-free solders in a 3.5 wt % NaCl solution
    Chang, TC
    Hon, MH
    Wang, MC
    Lin, DY
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2004, 151 (07) : C484 - C491
  • [8] Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate
    CHEN Wenxue
    Rare Metals, 2009, 28 (06) : 656 - 660
  • [9] Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate
    Chen Wenxue
    Xue Songbai
    Wang Hui
    Wang Jianxin
    Han Zongjie
    RARE METALS, 2009, 28 (06) : 656 - 660
  • [10] Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate
    Wenxue Chen
    Songbai Xue
    Hui Wang
    Jianxin Wang
    Zongjie Han
    Rare Metals, 2009, 28 : 656 - 660
12345