PCB Channel Optimization Techniques for High-Speed Differential Interconnects

被引：0
|
作者：
Chew, Li Wern [1 ]
Tan, Cheng Yu [1 ]
Chai, Ming Dak [1 ]
Lim, Yun Rou [1 ]
机构：
[1] Intel Microelectronics (M) Sdn. Bhd., Malaysia Design Center, Penang, Malaysia
来源：
2022 International Conference on Electronics Packaging, ICEP 2022 | 2022年
关键词：
Compendex;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Busbars
引用
收藏
页码：189 / 190
相关论文
共 50 条
  • [1] PCB Channel Optimization Techniques for High-Speed Differential Interconnects
    Chew, Li Wern
    Tan, Cheng Yu
    Chai, Ming Dak
    Lim, Yun Rou
    [J]. 2022 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2022), 2022, : 189 - 190
  • [2] Optimization of high-speed VLSI interconnects: A review
    Zhang, QJ
    Wang, F
    Nakhla, M
    [J]. INTERNATIONAL JOURNAL OF MICROWAVE AND MILLIMETER-WAVE COMPUTER-AIDED ENGINEERING, 1997, 7 (01): : 83 - 107
  • [3] Transmitter and channel equalization for high-speed server interconnects
    de Araujo, DN
    Diepenbrock, J
    Cases, M
    Pham, N
    [J]. ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2003, : 221 - 224
  • [4] Fast Estimation of High-Speed Signal Integrity for Coupled PCB Interconnects
    Eudes, Thomas
    Ravelo, Blaise
    Lacrevaz, Thierry
    Flechet, Bernard
    [J]. 2013 17TH IEEE WORKSHOP ON SIGNAL AND POWER INTEGRITY (SPI), 2013,
  • [5] High-speed interconnects
    Powers, G
    [J]. AEROSPACE ENGINEERING, 2003, 23 (02) : 19 - 21
  • [6] STATISTICAL SIMULATION AND OPTIMIZATION OF HIGH-SPEED VLSI INTERCONNECTS
    ZHANG, QJ
    NAKHLA, MS
    [J]. ANALOG INTEGRATED CIRCUITS AND SIGNAL PROCESSING, 1994, 5 (01) : 95 - 106
  • [7] An Optimization Framework for the Design of High-Speed PCB VIAs
    Avitabile, Gianfranco
    Florio, Antonello
    Gallo, Vito Leonardo
    Pali, Alessandro
    Forni, Lorenzo
    [J]. ELECTRONICS, 2022, 11 (03)
  • [8] Signal integrity optimization of high-speed VLSI packages and interconnects
    Zhang, QJ
    Wang, F
    Nakhla, MS
    Bandler, JW
    Biernacki, RM
    [J]. 48TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1998 PROCEEDINGS, 1998, : 1073 - 1076
  • [9] Optimization of high-speed VLSI interconnects: A review (Invited article)
    Carleton Univ, Ottawa, Canada
    [J]. Int J Microwave Millimeter Wave Comput Aided Eng, 1 (83-107):
  • [10] Thermal Impact on High Speed PCB Interconnects
    Pathania, Sunil
    Vasa, Mallikarjun
    Mutnury, Bhyrav
    Sharma, Rohit
    [J]. 2019 IEEE 28TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS 2019), 2019,
12345