Finite element method analysis of nanoscratch test for the evaluation of interface adhesion strength in Cu thin films on Si substrate

被引：0
|
作者：
Sekiguchi, Atsuko [1 ]
Koike, Junichi [1 ]
机构：
[1] Department of Materials Science, Tohoku University, Sendai 980-8579, Japan
来源：
Japanese Journal of Applied Physics | 2008年 / 47卷 / 01期
关键词：
Thin films;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Journal article (JA)
引用
收藏
页码：249 / 256
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