Interfacial reactions between Sn-3.5Ag solder and electroless Ni-P during soldering and aging

被引：0
|
作者：
Huang, Ming-Liang [1 ,2 ]
Bai, Dong-Mei [1 ,2 ]
机构：
[1] School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China
[2] Key Laboratory of Liaoning Advanced Welding and Joining Technology, Dalian University of Technology, Dalian 116024, China
来源：
Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals | 2010年 / 20卷 / 06期
关键词：
Binary alloys - Growth kinetics - Lead-free solders - Soldering;
D O I：
暂无
中图分类号：
TG457 [各种金属材料和构件的焊接];
学科分类号：
摘要：
The wetting behavior of Sn-3.5Ag solder on the electroless Ni-P film with 6.5% P (mass fraction) during soldering and the interfacial reactions between Sn-3.5Ag solder and electroless Ni-6.5% P during soldering and aging were investigated. The results show that the wetting angle is about 44° and the spreading coefficient is about 67% using the solder balls with diameter of (2.3±0.06) mm at 25°C. The soldering interface are composed of a Ni3Sn4 IMC layer, a thinner Ni-Sn-P layer and a Ni3P crystallization layer between Sn-3.5Ag solder and electroless Ni-P. The growth kinetics of the interfacial IMC Ni3Sn4 during soldering follows a linear relation with cubic root of soldering time. The growth kinetics of interfacial IMC Ni3Sn4 and P-enriched layer during aging obeys a linear relation with square root of aging time.
引用
收藏
页码：1189 / 1194
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