Technology advances and globalization in electronic and electro-optical packaging

Semiconductor technology and integrated optical device technology, coupled with modern, miniaturized packaging, form the backbone of today's high-performance electronic and electro-optical systems. This article explores some current and future electronic and electro-optical device technologies and their impacts on APL. It also explores the ramifications and impact of globalization on the accessibility of this technology toAPL In a similar vein, the article describes the latest trends in packaging and how packaging is essential to the development of high-performance systems. Packaging has been fully globalized for many years, and thus the question is not when globalization will occur but rather how to best exploit the global packaging technology and keep critical access for APL. The packaging discussion also focuses on important APL advances in optical waveguides and transitions as well as on advanced flexible-integrated-circuit assemblies.