Effect of isothermal aging on microstructure at the interface between SnX5.0Cu1.5Ni solder and Cu substrate

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[1] Li, Wei
[2] Chen, Hai-Yan
[3] Jie, Xiao-Hua
[4] Zhang, Hai-Yan
[5] Guo, Li
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Chen, H.-Y. (gdutchy1@163.com) | 1600年 / Editorial Office of Transactions of Materials, 18 Xueqing Road, Beijing, 100083, China卷 / 34期
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