Effect of an abrupt growth rate on primary Al2Cu phase in directional solidification of Al-40%Cu hypereutectic alloy

被引:0
|
作者
Quan, Qiongrui [1 ]
Li, Shuangming [1 ]
Fu, Hengzhi [1 ]
机构
[1] State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi'an 710072, China
来源
关键词
Compendex;
D O I
暂无
中图分类号
学科分类号
摘要
Binary alloys
引用
收藏
页码:500 / 505
相关论文
共 50 条
  • [21] Effect of solidification rate on microstructures and orientations of Al-Cu hypereutectic alloy in thin crucible
    Gao, Ka
    Li, Shuangming
    Xu, Lei
    Fu, Hengzhi
    CRYSTAL RESEARCH AND TECHNOLOGY, 2014, 49 (2-3) : 164 - 170
  • [22] Directional solidification of Al–Cu–Ag alloy
    U. Böyük
    N. Maraşlı
    H. Kaya
    E. Çadırlı
    K. Keşlioğlu
    Applied Physics A, 2009, 95 : 923 - 932
  • [23] Effect of Ce on morphology of α(Al)-Al2Cu eutectic in Al-Si-Cu alloy
    Voncina, Maja
    Medved, Jozef
    Boncina, Tonica
    Zupanic, Franc
    TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, 2014, 24 (01) : 36 - 41
  • [24] Measurements of microhardness during transient horizontal directional solidification of Al-Rich Al-Cu alloys: Effect of thermal parameters, primary dendrite arm spacing and Al2Cu intermetallic phase
    André Santos Barros
    Igor Alexsander Magno
    Fabrício Andrade Souza
    Carlos Alberto Mota
    Antonio Luciano Moreira
    Maria Adrina Silva
    Otávio Lima Rocha
    Metals and Materials International, 2015, 21 : 429 - 439
  • [25] Eutectic solidification of ternary Al-Cu-Ag alloys:: Coupled growth of α(Al) and Al2Cu in univariant reaction
    Hecht, U
    Witusiewicz, VT
    Drevermann, A
    Böttger, B
    Rex, S
    SOLIDIFICATION AND GRAVITY IV, 2006, 508 : 57 - 62
  • [26] Atomic bonding and properties of al-cu alloy with θ(Al2Cu)
    Gao, Yingjun
    Mo, Qifeng
    Luo, Zhirong
    Zhang, Lina
    Huang, Chuanggao
    JOURNAL OF ELECTRONIC MATERIALS, 2006, 35 (10) : 1801 - 1805
  • [27] Atomic bonding and properties of Al-Cu alloy with ϑ(Al2Cu)
    Yingjun Gao
    Qifeng Mo
    Zhirong Luo
    Lina Zhang
    Chuanggao Huang
    Journal of Electronic Materials, 2006, 35 : 1801 - 1805
  • [28] Unveiling the Growth Mechanism of Faceted Primary Al2Cu with Complex Morphologies During Solidification
    Zongye Ding
    Qiaodan Hu
    Fan Yang
    Liao Yu
    Tianxing Yang
    Naifang Zhang
    Wenquan Lu
    Jingwei Yang
    Jian Qiao
    Jianguo Li
    Acta Metallurgica Sinica(English Letters), 2022, 35 (01) : 124 - 132
  • [29] Unveiling the Growth Mechanism of Faceted Primary Al2Cu with Complex Morphologies During Solidification
    Ding, Zongye
    Hu, Qiaodan
    Yang, Fan
    Yu, Liao
    Yang, Tianxing
    Zhang, Naifang
    Lu, Wenquan
    Yang, Jingwei
    Qiao, Jian
    Li, Jianguo
    ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 35 (01) : 124 - 132
  • [30] Unveiling the Growth Mechanism of Faceted Primary Al2Cu with Complex Morphologies During Solidification
    Zongye Ding
    Qiaodan Hu
    Fan Yang
    Liao Yu
    Tianxing Yang
    Naifang Zhang
    Wenquan Lu
    Jingwei Yang
    Jian Qiao
    Jianguo Li
    Acta Metallurgica Sinica (English Letters), 2022, 35 : 124 - 132