Stress fields and singularities at notch and crack tips of piezoelectric materials

被引:0
|
作者
Yang, Qing-Sheng [1 ]
Feng, Si-Wei [1 ]
Tan, Xiang-Jun [1 ]
机构
[1] College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100022, China
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:41 / 45
相关论文
共 50 条
  • [41] Crack Tip Fields for Anti-plane Interfacial Crack between Functionally Graded and Homogeneous Piezoelectric Materials
    Chong, Xiao
    Dai, Yao
    Hao, Guixiang
    Zhang, Zhiqiang
    PROCEEDINGS OF THE 3RD INTERNATIONAL CONFERENCE ON MATERIAL, MECHANICAL AND MANUFACTURING ENGINEERING, 2015, 27 : 1744 - 1747
  • [42] The Higher Order Crack Tip Fields for Anti-plane Crack in Power Functionally Graded Piezoelectric Materials
    Dai Yao
    Chong Xiao
    Pan Jing-wen
    PROCEEDINGS OF THE 2015 INTERNATIONAL CONFERENCE ON MATERIALS, ENVIRONMENTAL AND BIOLOGICAL ENGINEERING, 2015, 10 : 1011 - 1014
  • [43] The Crack Tip Fields for Anti-plane Crack in Functionally Graded Piezoelectric Materials with Arbitrarily Gradient Direction
    Dai Yao
    Chong Xiao
    Sun Wei-hai
    PROCEEDINGS OF THE 2015 INTERNATIONAL CONFERENCE ON MATERIALS, ENVIRONMENTAL AND BIOLOGICAL ENGINEERING, 2015, 10 : 1007 - 1010
  • [44] The higher order crack tip fields for anti-plane crack in power functionally graded piezoelectric materials
    Dai, Y.
    Chong, X.
    Huang, J. C.
    Manufacturing and Engineering Technology, 2015, : 565 - 568
  • [45] Higher Order Crack-tip Fields for Mode III Crack in Power Functionally Graded Piezoelectric Materials
    Chong, Xiao
    Pan, Jing-wen
    Dai, Yao
    ADVANCED MATERIAL ENGINEERING (AME 2015), 2016, : 693 - 698
  • [46] The Crack Tip Fields for Anti-plane Crack in Functionally Graded Piezoelectric Materials with Arbitrarily Gradient Direction
    Chong Xiao
    Dai Yao
    Xue Chun-fang
    PROCEEDINGS OF 2014 IEEE WORKSHOP ON ADVANCED RESEARCH AND TECHNOLOGY IN INDUSTRY APPLICATIONS (WARTIA), 2014, : 92 - 95
  • [47] Meshless Numerical Simulation of Singular Fields at Crack Tips of Branched Crack
    Bai, Yinghua
    Tian, Ran
    Tang, Xu
    Kong, Lin-Hao
    Liu, Jia-Hui
    Nie, Fenghua
    INTERNATIONAL JOURNAL OF COMPUTATIONAL METHODS, 2021, 18 (07)
  • [48] Mixed Mode 3D Stress Fields and Crack Front Singularities for Surface Flaw
    Shlyannikov, V. N.
    Tumnov, A. V.
    11TH INTERNATIONAL CONFERENCE ON THE MECHANICAL BEHAVIOR OF MATERIALS (ICM11), 2011, 10 : 1133 - 1138
  • [49] Effect of crack face residual surface stress on nanoscale fracture of piezoelectric materials
    Nan, H. S.
    Wang, B. L.
    ENGINEERING FRACTURE MECHANICS, 2013, 110 : 68 - 80
  • [50] Superposition method for calculating singular stress fields at kinks, branches and tips in multiple crack arrays
    Burton Jr., J. Kenneth
    Phoenix, S. Leigh
    International Journal of Fracture, 2000, 102 (02) : 99 - 139