Design and optimization on the bonding head with parallel structure in IC die bonder

被引：0
|
作者：
Li, Ketian [1 ]
Chen, Xin [1 ]
Liu, Ji'an [1 ]
Fan, Yunmou [1 ]
机构：
[1] Guangdong University of Technology, Guangzhou 510006, China
来源：
Zhongguo Jixie Gongcheng/China Mechanical Engineering | 2008年 / 19卷 / 10期
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摘要：
Bonding head is the key execute parts of the IC die bonder. The parallel bonding structure was proposed, and working principles and structure size optimization were discussed. Two driving motors of the bonding head were fixed in the rack and never move as the bonding head moves, so the weight of the executor is light. The bonding head standed as triangle style, so the rigidity of the structure is high. By controlling the two motors in the way of collaboration, the bonding head can fulfill the function of IC chip picking, transporting, and bonding, etc.
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页码：1160 / 1162
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