共 50 条
- [1] Design and optimization on the bonding head with parallel structure in IC die bonder Zhongguo Jixie Gongcheng/China Mechanical Engineering, 2008, 19 (10): : 1160 - 1162
- [2] Design of lead-frame driving mechanical structure of Die Bonder ICEPT: 2006 7TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2006, : 704 - +
- [3] AUTOMATED STRUCTURE DESIGN IN 3D ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1991, 202 : 48 - COMP
- [4] CAD/CAM Tool for 3D woven textile fabric design 32nd Technical Conference of the American Society for Composites 2017, 2017, 1 : 539 - 546
- [5] 3D Parametric Design and Performance Test of Precision Cam Divider ENGINEERING SOLUTIONS FOR MANUFACTURING PROCESSES IV, PTS 1 AND 2, 2014, 889-890 : 22 - 27
- [6] DESIGN OF 3D TOPOLOGICAL DATA STRUCTURE FOR 3D CADASTRE OBJECTS INTERNATIONAL CONFERENCE ON GEOMATIC AND GEOSPATIAL TECHNOLOGY (GGT) 2016, 2016, 42-4 (W1): : 325 - 327
- [8] A 3D package design with cavity substrate and stacked die 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2013, : 64 - 67