The strength of wide bandgap materials for power electronics

被引:0
|
作者
机构
[1] Husain, Ali
来源
Husain, Ali | 1600年 / Datateam Business Media Limited卷 / 127期
关键词
Power semiconductor devices;
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [31] Thermal Modeling of Wide Bandgap Materials for Power MOSFETs
    Manandhar, Mahesh B.
    Matin, Mohammad A.
    WIDE BANDGAP POWER DEVICES AND APPLICATIONS, 2016, 9957
  • [32] Nanocrystalline wide bandgap nitrides for electronics
    Szmidt, J
    Werbowy, A
    Jakubowski, A
    Sokolowska, A
    Olszyna, A
    PHYSICS OF SEMICONDUCTOR DEVICES, VOLS 1 AND 2, 1998, 3316 : 102 - 105
  • [33] Wide Bandgap Semiconductor Electronics and Devices
    Shea, John J.
    IEEE ELECTRICAL INSULATION MAGAZINE, 2020, 36 (06) : 64 - 65
  • [34] Power Electronics Revolutionized: A Comprehensive Analysis of Emerging Wide and Ultrawide Bandgap Devices
    Rafin, S. M. Sajjad Hossain
    Ahmed, Roni
    Haque, Md. Asadul
    Hossain, Md. Kamal
    Haque, Md. Asikul
    Mohammed, Osama A.
    Wang, Zeheng
    Huang, Jing-Kai
    MICROMACHINES, 2023, 14 (11)
  • [35] Advanced materials and structures for high power wide bandgap devices
    Shaddock, D
    Meyer, L
    Tucker, J
    Dasgupta, SI
    Fillion, R
    NINETEENTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, 2003, : 42 - 47
  • [36] Review of Wide Bandgap Materials and their Impact in New Power Devices
    Garrido-Diez, David
    Baraia, Igor
    2017 IEEE INTERNATIONAL WORKSHOP OF ELECTRONICS, CONTROL, MEASUREMENT, SIGNALS AND THEIR APPLICATION TO MECHATRONICS (ECMSM), 2017,
  • [37] Wide Bandgap Analog and Mixed-Signal IC Design for Advanced Power Electronics
    Mantooth, H. A.
    WIDE BANDGAP SEMICONDUCTOR MATERIALS AND DEVICES 18, 2017, 77 (06): : 41 - 49
  • [38] Enhanced Sintered Silver for SiC Wide Bandgap Power Electronics Integrated Package Module
    Lu, Mei-Chien
    JOURNAL OF ELECTRONIC PACKAGING, 2019, 141 (03)
  • [39] Partial Discharges of Insulated Wires under Impulses from Wide Bandgap Power Electronics
    Helmholdt-Zhu, Ting
    Grau, Vivien
    Obernolte, Urs
    2022 24TH EUROPEAN CONFERENCE ON POWER ELECTRONICS AND APPLICATIONS (EPE'22 ECCE EUROPE), 2022,
  • [40] Design and Development of Hybrid Current Sensors for Wide-Bandgap Power Electronics Applications
    Sirat, Ali Parsa
    Niakan, Hossein
    Gafford, James
    Parkhideh, Babak
    2024 IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, APEC, 2024, : 260 - 266