The effect of thiourea, L(-) cysteine and glycine additives on the mechanisms and kinetics of copper electrodeposition

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[1] Tadesse, Bogale
[2] Horne, Michael
[3] Addai-Mensah, Jonas
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Addai-Mensah, J. (jonas.addai-mensah@unisa.edu.au) | 1600年 / Kluwer Academic Publishers卷 / 43期
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The influence of thiourea; l(-) cysteine and glycine on the mechanisms and kinetics of copper electrodeposition from aqueous solution at pH 1.00 ± 0.05 and 25 C was investigated using several complementary techniques. Rotating disc electrode current density measurements and the kinetic parameters calculated from Koutecký-Levich analysis indicated that at 5 × 10-3 M thiourea and l(-) cysteine addition the electro-reduction of Cu(II) was significantly inhibited. By contrast; upon similar addition of glycine; the reduction current density increased and the equilibrium potential moved towards more positive values. Microscopic imaging studies of the resulting Cu films showed that thiourea and l(-) cysteine led to fine-grained deposits; whilst glycine addition resulted in a coarser deposit. It is suggested the additives substantially altered the electron and mass transfer processes during electrodeposition. Both thiourea and l(-) cysteine appear to act by specific chemical interactions that lead to CuS co-crystallization. On the other hand; glycine is believed to act by mediating the Cu(II) to Cu(I) reduction process. © 2013 Springer Science+Business Media Dordrecht;
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