Vibration cutting analysis of axially moving diamond wire saw excited by transverse ultrasonic wave

被引:0
|
作者
机构
[1] [1,Li, Lun
[2] Li, Shu-Juan
[3] Tang, Ao-Fei
[4] Li, Yan
来源
Li, Lun | 1651年 / China Ordnance Industry Corporation卷 / 35期
关键词
15;
D O I
10.3969/j.issn.1000-1093.2014.10.020
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [1] Surface roughness prediction of SiC monocrystalline cut by diamond wire-saw excited by transverse ultrasonic vibration
    School of Mechanical and Precision Instrument Engineering, Xi'an University of Technology, Xi'an
    710048, China
    不详
    471023, China
    Jixie Gongcheng Xuebao, 1600, 19 (204-212):
  • [2] Research on Cutting Force of Ultrasonic Diamond Wire Saw
    张辽远
    李鑫
    Journal of China Ordnance, 2010, (02) : 114 - 118
  • [3] Research on transverse vibrations of the stringed bead wire of an underwater diamond wire saw transverse vibration
    Wang, Hai-Bo
    Meng, Qing-Xin
    Wang, Li-Quan
    Cao, Li-Wen
    Harbin Gongcheng Daxue Xuebao/Journal of Harbin Engineering University, 2007, 28 (11): : 1257 - 1262
  • [4] Machining method on electroplated diamond wire saw with ultrasonic vibration
    Zhang, Liao-Yuan
    Jia, Chun-De
    Lu, Yu-Shan
    Binggong Xuebao/Acta Armamentarii, 2006, 27 (05): : 899 - 902
  • [5] Research on normal cutting force of transverse ultrasonic-assisted wire saw vibration cutting SiC monocrystal wafer
    Li, Lun
    Li, Yan-Jun
    Li, Ji-Shun
    Rengong Jingti Xuebao/Journal of Synthetic Crystals, 2015, 44 (12): : 3730 - 3735
  • [6] Dynamic Characteristics Analysis and Simulations of Transverse Vibration of Axially Moving Electrode Wire in WEDM
    Fan, Shengyao
    Zhang, Qiuju
    Chen, Haiwei
    MECHATRONICS AND MATERIALS PROCESSING I, PTS 1-3, 2011, 328-330 : 1792 - 1796
  • [7] Effects of Cutting Parameters on the Transverse Vibration of Diamond Circular saw blade
    Fang, Huaiying
    Li, Yuan
    Huang, Hui
    Xu, Xipeng
    ADVANCES IN ABRASIVE TECHNOLOGY XIII, 2010, 126-128 : 667 - 671
  • [8] Transverse Vibration Analysis of Axially Moving Trapezoidal Plates
    Zhang, Man
    Dong, Ji-Xian
    JOURNAL OF NANOELECTRONICS AND OPTOELECTRONICS, 2021, 16 (06) : 978 - 986
  • [9] Electroplated diamond wire saw applying ultrasonic vibration to cut polysilicon experiment and simulation analysis
    Zhang Liaoyuan
    Wang Shuo
    Shao Zhongqing
    Lv Zhongxiu
    ADVANCED MATERIALS AND PROCESSES III, PTS 1 AND 2, 2013, 395-396 : 1044 - +
  • [10] Analysis on Vibration of a Moving Wire in the Wafer Slicing Multi Wire Saw
    Feng, Yanbo
    Sun, Tao
    APPLIED ELECTROMAGNETICS AND MECHANICS (II), 2009, 13 : 555 - 556