共 50 条
- [1] Surface roughness prediction of SiC monocrystalline cut by diamond wire-saw excited by transverse ultrasonic vibration Jixie Gongcheng Xuebao, 1600, 19 (204-212):
- [3] Research on transverse vibrations of the stringed bead wire of an underwater diamond wire saw transverse vibration Harbin Gongcheng Daxue Xuebao/Journal of Harbin Engineering University, 2007, 28 (11): : 1257 - 1262
- [4] Machining method on electroplated diamond wire saw with ultrasonic vibration Binggong Xuebao/Acta Armamentarii, 2006, 27 (05): : 899 - 902
- [5] Research on normal cutting force of transverse ultrasonic-assisted wire saw vibration cutting SiC monocrystal wafer Rengong Jingti Xuebao/Journal of Synthetic Crystals, 2015, 44 (12): : 3730 - 3735
- [6] Dynamic Characteristics Analysis and Simulations of Transverse Vibration of Axially Moving Electrode Wire in WEDM MECHATRONICS AND MATERIALS PROCESSING I, PTS 1-3, 2011, 328-330 : 1792 - 1796
- [7] Effects of Cutting Parameters on the Transverse Vibration of Diamond Circular saw blade ADVANCES IN ABRASIVE TECHNOLOGY XIII, 2010, 126-128 : 667 - 671
- [9] Electroplated diamond wire saw applying ultrasonic vibration to cut polysilicon experiment and simulation analysis ADVANCED MATERIALS AND PROCESSES III, PTS 1 AND 2, 2013, 395-396 : 1044 - +
- [10] Analysis on Vibration of a Moving Wire in the Wafer Slicing Multi Wire Saw APPLIED ELECTROMAGNETICS AND MECHANICS (II), 2009, 13 : 555 - 556