Research on Cutting Force of Ultrasonic Diamond Wire Saw

被引：5
|
作者：
张辽远 [1 ]
李鑫 [1 ]
机构：
[1] Department of Mechanical Engineering,Shenyang Ligong University
来源：
Defence Technology | 2010年 / 6卷 / 02期
关键词：
machinofature technique and equipment mechanics; manufacturing process; hard and brittle material; electroplated diamond wire saw; ultrasonic machining;
D O I：
暂无
中图分类号：
TG501.3 [切削力、功率];
学科分类号：
080201 ; 080503 ;
摘要：
Based on impulse and vibration machining theories,a mathematical model of cutting force for the electroplated diamond ultrasonic wire saw was established using superposition principle.The differences between the cutting forces with and without ultrasonic effect were analyzed theoretically and experimentally.The results indicate that the cutting force of diamond wire increases along with the spindle speed decrease and the lateral pressure increase.The force in ultrasonic vibration cutting is about 20% to 30% less than that in conventional cutting.Also,the cutting trajectory of single diamond grit in sawing process is simulated,and the reason that the ultrasonic vibration can reduce the cutting force is explained further.
引用
收藏
页码：114 / 118
页数：5
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