IEEE 3D System Integration Conference 2010 (3DIC)

被引：0
|
作者：
Ramm, Peter [1 ]
Beyne, Eric [2 ]
机构：
[1] Department of Device and 3D Integration, Fraunhofer EMFT, Germany
[2] Advanced Packaging and Interconnect Research, imec, Belgium
来源：
IEEE 3D System Integration Conference 2010, 3DIC 2010 | 2010年
关键词：
D O I：
10.1109/3DIC.2010.5751430
中图分类号：
学科分类号：
摘要：
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