Deposition of uniform carbon film on silicon substrate by chemical solution process

被引:0
|
作者
Hashimoto Y. [1 ]
Suzumura T. [2 ]
机构
[1] Department of Electrical and Electronic Engneering, Daido University, 10-3, Takiharu-cho, Minami-ku, Nagoya
[2] Shinsei Technos Co., Ltd., 2-4-1, Shiba-koen, Minato-ku, Tokyo
关键词
Carbon; Electron irradiation; Electron-beam excited plasma; Solution growth;
D O I
10.1541/ieejfms.139.326
中图分类号
学科分类号
摘要
Uniform carbon film was grown on silicon substrate treated by low energy electron at temperature of 60 degrees in the methanol solution. The treatment was carried out to modify the silicon surface by electron irradiation of 50 eV using electron-beam-excited plasma. From the results of Raman and X-ray diffraction spectra, it was confirmed that the film is crystalline carbon containing small amounts of diamond component. The ID/IG ratio and work function of carbon film increased with increasing treatment time of the silicon substrate. The increases of ID/IG ratio and work function suggest that the carbon film had greater concentration of diamond component. On the other hand, the surface roughness and work function of the silicon substrate increased due to an increase of treatment time. The variations of physical and electronic properties are attributed to carbon deposition during the growth process. © 2019 The Institute of Electrical Engineers of Japan.
引用
收藏
页码:326 / 332
页数:6
相关论文
共 50 条
  • [41] Uniform deposition of ultra-thin TiO2 film on mica substrate by atmospheric pressure chemical vapor deposition: Effect of precursor concentration
    Ming Liu
    Ying Li
    Rui Wang
    Guoqiang Shao
    Pengpeng Lv
    Jun Li
    Qingshan Zhu
    ChineseJournalofChemicalEngineering, 2023, 60 (08) : 99 - 107
  • [42] Uniform deposition of ultra-thin TiO2 film on mica substrate by atmospheric pressure chemical vapor deposition: Effect of precursor concentration
    Liu, Ming
    Li, Ying
    Wang, Rui
    Shao, Guoqiang
    Lv, Pengpeng
    Li, Jun
    Zhu, Qingshan
    CHINESE JOURNAL OF CHEMICAL ENGINEERING, 2023, 60 : 99 - 107
  • [43] A new process for minimizing residual silicon and carbon of reaction-bonded silicon carbide via chemical vapor deposition
    Lee, Jisu
    Kim, Daejong
    Shin, Dongwook
    Lee, Hyeon-Geun
    Park, Ji Yeon
    Kim, Weon-Ju
    JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2021, 41 (07) : 4000 - 4005
  • [44] Role of substrate on the growth process of polycrystalline silicon thin films by low-pressure chemical vapour deposition
    Pereira, L
    Aguas, H
    Raniero, L
    Martins, RMS
    Fortunato, E
    Martins, R
    ADVANCED MATERIALS FORUM II, 2004, 455-456 : 112 - 115
  • [45] Structural and optical properties thin film copper oxides formed by chemical solution deposition process technique
    Lockman, Zainovia
    Abidin, Noor Rehan Zainal
    Derita, Sabar
    SOLID STATE SCIENCE AND TECHNOLOGY, 2007, 909 : 80 - +
  • [46] Effects of supersaturation on CdS film growth from dilute solutions on glass substrate in chemical bath deposition process
    Chen, Fuyi
    Jie, Wanqi
    Cai, Xiaomei
    THIN SOLID FILMS, 2008, 516 (10) : 2823 - 2828
  • [47] The chemical process for materials deposition in aqueous solution: a review
    Oliva, A. I.
    Gonzalez-Chan, I. J.
    Varguez, P. E.
    Trejo-Ramos, A. I.
    Oliva-Aviles, A. I.
    SURFACE ENGINEERING, 2022, 38 (10-12) : 907 - 929
  • [48] MgB2 thick film grown on silicon carbide substrate by hybrid physical-chemical vapor deposition
    Li, Fen
    Guo, Tao
    Zhang, Kai-Cheng
    Chen, Li-Ping
    Chen, Chinping
    Feng, Qing-Rong
    2006 BIMW: 2006 BEIJING INTERNATIONAL MATERIALS WEEK, PTS 1-4: MAGNESIUM, 2007, 546-549 : 2067 - +
  • [49] Rhenium coating prepared on carbon substrate by chemical vapor deposition
    Tong, Yonggang
    Bai, Shuxin
    Zhang, Hong
    Ye, Yicong
    APPLIED SURFACE SCIENCE, 2012, 261 : 390 - 395
  • [50] Mechanism of the chemical deposition of nickel on silicon wafers in aqueous solution
    Takano, N
    Hosoda, N
    Yamada, T
    Osaka, T
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1999, 146 (04) : 1407 - 1411