Wettability of Sn-9Zn-xAg lead-free solder and mechanical properties of soldered joints

被引：0
|
作者：
Chen, Wenxue [1 ]
Xue, Songbai [1 ]
Wang, Hui [1 ]
Wang, Jianxin [1 ]
机构：
[1] College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China
来源：
Hanjie Xuebao/Transactions of the China Welding Institution | 2009年 / 30卷 / 06期
关键词：
Ternary alloys - Zinc compounds - Silver alloys - Zinc alloys - Fracture - Binary alloys - Silver compounds - Tin alloys - Wetting;
D O I：
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学科分类号：
摘要：
The effects of Ag on the wettability of Sn-9Zn lead-free solder and the mechanical properties of soldered joints are investigated respectively. The results indicate that when the content of Ag is 0.3wt.%, the solder gets the best wettability; when the content of Ag is from 0.5wt.% to 1wt.%, the wettability decreases. The best mechanical property of soldered joint is obtained when the content of Ag is 0.3wt.%. Moreover, the fracture micrographs show that plenty of dimples are found on the Sn-9Zn-0.3Ag soldered joints fractures. When the content of Ag is 1wt.%, some Cu-Zn and Ag-Zn intermetallic compounds appear on the bottom of dimples, and the mechanical property of the soldered joint decreases. In general, the optimum additive amount of Ag in Sn-9Zn solder is about 0.3wt.%.
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页码：75 / 78
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