Design and analysis of NCP packaging process for fine-pitch flexible printed circuit board

被引：0
|
作者：
Shim J.H.
Cha D.H.
机构：
来源：
Journal of Institute of Control, Robotics and Systems | 2010年 / 16卷 / 02期
关键词：
Bonding; COF; Fine-pitch; NCP; Packaging; Pressure; Reliability;
D O I：
10.5302/J.ICROS.2010.16.2.172
中图分类号：
学科分类号：
摘要：
Recently, LCD (Liquid Crystal Display) requires various technical challenges; high definition, high quality, big size, and low price. These demands more pixels in the fixed area of the LCD and very fine lead pitch of the driving IC which controls the pixels. Therefore, a new packaging technology is needed to meet such technical requirement. NCP (Non Conductive Paste) is one of the new packaging methods and has excellent characteristics to overcome the problems of the ACF (Anisotropic Conductive Film). In this paper, we analyzed the process of the NCP for COF (Chip on FPCB) and proposed the key design parameters of the NCP process. Through a series of experiments, we obtained the stable values of the design parameters for successful NCP process.
引用
收藏
页码：172 / 176
页数：4
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