Damage behavior of SnAgCu/Cu solder joints subjected to thermomechanical cycling

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[1] Xiao, H.
[2] Li, X.Y.
[3] Hu, Y.
[4] Guo, F.
[5] Shi, Y.W.
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Xiao, H. (xiaohui2013@yahoo.com.cn) | 1600年 / Elsevier Ltd卷 / 578期
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