Numerical analysis of passive intermodulation due to metallic contact nonlinearity

被引：0
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作者：
School of Electronic and Information Engineering, Beihang University, Beijing [1 ]
100191, China
不详 [2 ]
Shaanxi
710071, China
不详 [3 ]
Shaanxi
710100, China
机构：
来源：
Tien Tzu Hsueh Pao | / 6卷 / 1174-1178期
关键词：
Compendex;
D O I：
10.3969/j.issn.0372-2112.2015.06.020
中图分类号：
学科分类号：
摘要：
Electromagnetic simulation
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