Research on bonding properties of electrically conductive adhesives for hybrid microcircuits application

被引：0
|
作者：
School of Physics Science and Technology, Central South University, Changsha 410083, China [1 ]
不详 [2 ]
机构：
来源：
Wuhan Ligong Daxue Xuebao | 2006年 / 3卷 / 18-21期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [41] Preparation of highly conductive silver nanowires for electrically conductive adhesives
    Jing Lu
    Di Liu
    Junfu Dai
    Journal of Materials Science: Materials in Electronics, 2019, 30 : 15786 - 15794
  • [42] Preparation of highly conductive silver nanowires for electrically conductive adhesives
    Lu, Jing
    Liu, Di
    Dai, Junfu
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 30 (16) : 15786 - 15794
  • [43] Electrically Conductive Adhesives with Sintered Silver Nanowires
    Zhang, Zhongxian
    Chen, Xiangyan
    Yang, Haowei
    Fu, Huiying
    Xiao, Fei
    2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009), 2009, : 754 - 757
  • [44] Silver migration control in electrically conductive adhesives
    Li, Yi
    Wong, C. P.
    2006 CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP '06), PROCEEDINGS, 2006, : 116 - +
  • [45] Future developments in electrically conductive adhesives technology
    Morris, JE
    MICRO MATERIALS, PROCEEDINGS, 2000, : 181 - 186
  • [46] Progress in characterization methods for electrically conductive adhesives
    Inoue M.
    Inoue, Masahiro, 2016, Japan Welding Society (85): : 325 - 330
  • [47] Validation of constitutive models for electrically conductive adhesives
    Meuwissen, Marcel
    van den Nieuwenhof, Monique
    Steijvers, Henk
    van der Waal, Adri
    Bois, Tom
    EUROSIME 2007: THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS, PROCEEDINGS, 2007, : 566 - +
  • [48] Fundamental study of electrically conductive adhesives (ECAs)
    Wong, CP
    Lu, DQ
    Meyers, L
    Vona, SA
    Tong, QK
    PEP '97 : THE FIRST IEEE INTERNATIONAL SYMPOSIUM ON POLYMERIC ELECTRONICS PACKAGING - PROCEEDINGS, 1997, : 80 - 85
  • [49] Electrical and thermomechanical modeling of electrically conductive adhesives
    Su, Bin
    Qu, Jianmin
    IEEE CPMT: INTERNATIONAL SYMPOSIUM AND EXHIBITION ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, 2006, : 69 - 69
  • [50] ADHESION MEASUREMENTS ON CONDUCTIVE LAYERS FOR HYBRID MICROCIRCUITS
    KADEREIT, HG
    SCHLEMM, A
    SIEMENS FORSCHUNGS-UND ENTWICKLUNGSBERICHTE-SIEMENS RESEARCH AND DEVELOPMENT REPORTS, 1977, 6 (04): : 220 - 225
12345