Non-Fourier thermal spike effect on nanocrystalline Cu phase engineering

被引:0
|
作者
Guan, Jiajian [1 ,2 ]
Gupta, Prasanth [3 ]
He, Zhen [4 ]
Rosli, Zulfitri [3 ]
Kennedy, John [3 ]
Gao, Wei [1 ]
Wang, Ziyun [2 ]
机构
[1] Department of Chemical and Materials Engineering, The University of Auckland, Auckland,1010, New Zealand
[2] School of Chemical Sciences, The University of Auckland, Auckland,1010, New Zealand
[3] National Isotope Centre, GNS Science, Lower Hutt,5010, New Zealand
[4] School of Materials Science and Engineering, Jiangsu University of Science and Technology, Zhenjiang,212003, China
关键词
Ion beam assisted deposition - Nanocrystalline materials - Nanocrystals - Rapid quenching - Thermal Engineering;
D O I
10.1016/j.apsusc.2024.161910
中图分类号
学科分类号
摘要
The thermal spike effect dominates rapid heating and quenching at the nanoscale in ion beam assisted materials surface phase engineering. This phenomenon often leads to the formation of metastable nanocrystalline phases in the resulting micro-/nanostructures. However, such a non-equilibrium process cannot be accurately described by the conventional Fourier thermal spike model. In this study, a non-Fourier model is proposed to elucidate the dynamics of heat diffusion in sub-keV Cu ion beam sputter deposition. The effects of beam density and energy on the non-equilibrium thermal and stress fields are quantitatively investigated. The influence of high stress field on nanocrystalline Cu phase content is also studied. It is found that the energetic Cu ion beams produce a rapidly oscillating stress field with a maximum of ∼ 10 GPa within 50 ps, which significantly constrains the growth of nanocrystalline Cu phase at a threshold of ∼ 4 GPa. This understanding provides new insights into the formation of metastable nanocrystalline phases in the fabrication and modification of surface micro-/nanostructures using ion beam assisted techniques. © 2024 The Authors
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