Modeling and design challenges and solutions for carbon nanotube-based interconnect in future high performance integrated circuits

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作者：
Rice University [1 ]
不详 [2 ]
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来源：
ACM J. Emerg. Technologies Comput. Syst. | 2006年 / 3卷 / 155-196期
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85;
D O I：
10.1145/1167943.1167944
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