Compound semiconductor MEMS community targets new applications

被引:0
|
作者
机构
来源
Compd. Semicond. | 2006年 / 2卷 / 23-25期
关键词
(Edited Abstract);
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [21] Standard semiconductor packaging for high reliability low cost MEMS applications
    Harney, KP
    RELIABILITY, PACKAGING, TESTING, AND CHARACTERIZATION OF MEMS/MOEMS IV, 2005, 5716 : 1 - 8
  • [22] Compound semiconductor quantum dots and nanowires for optoelectronic device applications
    Jagadish, Chennupati
    2007 THE JOINT INTERNATIONAL CONFERENCE ON OPTICAL INTERNET AND AUSTRALIAN CONFERENCE ON OPTICAL FIBRE TECHNOLOGY, 2007, : 331 - 331
  • [23] Layered compound semiconductor GaSe and GaTe crystals for THz applications
    Mandal, Krishna C.
    Kang, Sung H.
    Choi, Michael K.
    HETEROGENEOUS INTEGRATION OF MATERIALS FOR PASSIVE COMPONENTS AND SMART SYSTEMS, 2007, 969 : 111 - +
  • [24] Advantages of MEMS and Its Distinct New Applications
    Chen, Ying Jian
    METALLURGY TECHNOLOGY AND MATERIALS II, 2013, 813 : 205 - 209
  • [25] New MEMS timing references for automotive applications
    Lutz, M.
    McDonald, J.
    Gupta, P.
    Partridge, A.
    Dimpel, C.
    Petersen, K.
    Grace, R.
    ADVANCED MICROSYSTEMS FOR AUTOMOTIVE APPLICATIONS 2007, 2007, : 279 - +
  • [26] New applications emerging as MEMS technology advances
    Marshall, S
    R&D MAGAZINE, 1998, 40 (08): : 32 - +
  • [27] Growth and electrical properties of new semiconductor compound ZnCdHgTe
    Khlyap, G
    Sydorchuk, P
    CRYSTAL RESEARCH AND TECHNOLOGY, 2001, 36 (8-10) : 1027 - 1034
  • [28] Semiconductor polymer-based RF MEMS and its applications to microwave systems
    Varadan, VK
    Jose, KA
    Vinoy, KJ
    Varadan, VV
    SMART STRUCTURES AND MATERIALS 2000: SMART ELECTRONICS AND MEMS, 2000, 3990 : 43 - 52
  • [29] PHYSICS AND APPLICATIONS OF IV-VI COMPOUND SEMICONDUCTOR-LASERS
    PREIER, H
    SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 1990, 5 : S12 - S20
  • [30] COMPOUND SEMICONDUCTOR TRANSISTORS AND MMICS FOR LOW-POWER CONSUMPTION APPLICATIONS
    ABE, H
    NEC RESEARCH & DEVELOPMENT, 1995, 36 (01): : 132 - 133