Microstructure of brazed joint and properties of two lead-free solder powders

被引：0
|
作者：
Xu, Tian-Han [1 ,2 ]
Wang, Dang-Hui [1 ]
机构：
[1] College of Materials Science and Engineering, Xi'an Shiyou University, Xi'an 710065, China
[2] College of Materials Science and Engineering, Xi'an Jiaotong University, Xi'an 710049, China
来源：
Cailiao Rechuli Xuebao/Transactions of Materials and Heat Treatment | 2011年 / 32卷 / 01期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：28 / 33
相关论文
共 50 条
  • [41] Microstructure and mechanical properties of Sn-Zn-Bi-Cr lead-free solder
    Luo, Tingbi
    Hu, Anmin
    Hu, Jing
    Li, Ming
    Mao, Dali
    MICROELECTRONICS RELIABILITY, 2012, 52 (03) : 585 - 588
  • [42] Effects of Rare-Earth Addition on Properties and Microstructure of Lead-Free Solder Balls
    Yang Yu
    Zhidong Xia
    Fu Guo
    Yaowu Shi
    Journal of Electronic Materials, 2008, 37 : 975 - 981
  • [43] Effects of rare-earth addition on properties and microstructure of lead-free solder balls
    Yu, Yang
    Xia, Zhidong
    Guo, Fu
    Shi, Yaowu
    JOURNAL OF ELECTRONIC MATERIALS, 2008, 37 (07) : 975 - 981
  • [44] Influence of aging on microstructure and hardness of lead-free solder alloys
    Morando, Carina
    Fornaro, Osvaldo
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 2021, 33 (01) : 57 - 64
  • [45] Microstructure, Thermal and Wetting Properties of Sn-Bi-Zn Lead-Free Solder
    Chen, Xu
    Xue, Feng
    Zhou, Jian
    Liu, Sidong
    Qian, Guotong
    JOURNAL OF ELECTRONIC MATERIALS, 2013, 42 (08) : 2708 - 2715
  • [46] Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications
    Kang, Sung K.
    Lauro, Paul A.
    Shih, Da-Yuan
    Henderson, Donald W.
    Puttlitz, Karl J.
    IBM Journal of Research and Development, 1600, 49 (4-5): : 607 - 620
  • [47] Microstructure of solder joints with electronic components in lead-free solders
    Nakamura, Y
    Sakakibara, Y
    Watanabe, Y
    Amamoto, Y
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 1998, 10 (01) : 10 - +
  • [48] Production of fine uniform lead-free solder powders by hybrid atomization
    Minagawa, K
    Liu, YZ
    Kakisawa, H
    Takamori, S
    Osawa, Y
    Halada, K
    THERMEC'2003, PTS 1-5, 2003, 426-4 : 3341 - 3346
  • [49] Production of fine spherical lead-free solder powders by hybrid atomization
    Minagawa, K
    Kakisawa, H
    Osawa, Y
    Takamori, S
    Halada, K
    SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2005, 6 (3-4) : 325 - 329
  • [50] Impact Properties of Sn-0.75Cu Lead-free Solder Ball Joint
    Shohji, Ikuo
    Osawa, Tsutomu
    Okashita, Takeshi
    Watanabe, Hirohiko
    ADVANCES IN FRACTURE AND DAMAGE MECHANICS VII, 2008, 385-387 : 745 - +
12345