共 50 条
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- [2] Effects of magnetic field on microstructure and mechanical properties of lead-free solder joint 2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2015,
- [4] Phase stability assessment and microstructure modification at lead-free solder joint ICEPT: 2006 7TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2006, : 738 - +
- [5] Microstructure and Property of Au stud/Lead-free solder composite joint ICEPT2019: THE 2019 20TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2019,
- [6] The effect of multiple reflow times on lead-free solder joint microstructure ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 1, 2003, : 799 - 808
- [7] Lead-free Flux Effect in Lead-free Solder Joint Improvement IEMT 2006: 31ST INTERNATIONAL CONFERENCE ON ELECTRONICS MANUFACTURING AND TECHNOLOGY, 2006, : 541 - 548
- [9] Interfacial microstructure and mechanical properties of In–Bi–Sn lead-free solder Journal of Materials Science: Materials in Electronics, 2013, 24 : 2624 - 2629
- [10] Influence of Argon Reflow on the Microstructure and Properties of Lead-free Solder Joints 2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2015,