Optimum design of printed circuit board for warp reduction in reflow process

被引：0
|
作者：
Nakagawa, Yasutada [1 ]
机构：
[1] Toshiba Corporation, Corporate Manufacturing Engineering Center, 33 Shin-Isogo-cho, Yokohama-shi, Kanagawa, 235-0017, Japan
来源：
Nihon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C | 2006年 / 72卷 / 07期
关键词：
D O I：
10.1299/kikaic.72.2021
中图分类号：
学科分类号：
摘要：
引用
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页码：2021 / 2026
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