Effect on lead-free solder joint reliability caused by solder volume

被引：0
|
作者：
Yamabe M. [1 ]
Fukumitsu M. [1 ]
Fukuchi Y. [1 ]
机构：
[1] Toshiba Corporation, Japan
来源：
Yosetsu Gakkai Shi/Journal of the Japan Welding Society | 2010年 / 79卷 / 03期
关键词：
D O I：
10.2207/jjws.79.220
中图分类号：
学科分类号：
摘要：
[No abstract available]
引用
收藏
页码：16 / 21
页数：5
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