Evolution of the Sn-Bi Solder Microstructure vs. Temperature - An In- situ Scanning Electron Microscopy Study

被引：0
|
作者：
Tan, Xin F. [1 ,2 ]
Zhou, Jiye [1 ]
McDonald, Stuart D. [1 ]
Ikeda, Masahiko [3 ]
Nogita, Kazuhiro [1 ]
机构：
[1] The University of Queensland, School of Mechanical and Mining Engineering, Australia
[2] Kyushu University, Department of Applied Quantum Physics and Nuclear Engineering, Japan
[3] Nihon Superior Co., Ltd, Japan
来源：
2023 International Conference on Electronics Packaging, ICEP 2023 | 2023年
关键词：
Compilation and indexing terms; Copyright 2024 Elsevier Inc;
D O I：
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中图分类号：
学科分类号：
摘要：
Binary alloys - Bismuth alloys - Diffusion in solids - Electronics packaging - Eutectics - Microstructure - Temperature - Tin alloys
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页码：203 / 204
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