Pattern Design of SiC-TEG Heater Chip with Uniform Temperature Distribution Applied in Power Module Packaging

被引：0
|
作者：
Huo, Fupeng [1 ]
Wang, Ye [2 ]
Chen, Chuantong [1 ]
Geng, Peihao [3 ]
Zhang, Luobin [4 ]
Yamaguchi, Yoshiji [5 ]
Suganuma, Katsuaki [1 ]
机构：
[1] Osaka University, Flexible 3D System Integration Laboratory, The Institute of Science and Industrial Research, Osaka, Japan
[2] Beihang University, School of Reliability and Systems Engineering, Beijing, China
[3] Osaka University, Joining and Welding Research Institute, Osaka, Japan
[4] Harbin Institute of Technology, Sauvage Laboratory for Smart Materials, School of Materials Science and Engineering, Shenzhen, China
[5] Yamato Scientific Co. Ltd, Tokyo, Japan
来源：
2023 International Conference on Electronics Packaging, ICEP 2023 | 2023年
关键词：
Compendex;
D O I：
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学科分类号：
摘要：
Silicon carbide
引用
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页码：189 / 190
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