Modeling of ACF–COG Interconnection Resistance and Optimization of Process Parameters

被引：0
|
作者：
Chen, Ruiqing [1 ]
Liu, Lei [1 ]
Jia, Lei [2 ]
Luo, Chen [1 ]
Zhou, Yijun [1 ]
机构：
[1] School of Mechanical Eng., Southeast Univ., Nanjing,211189, China
[2] Wuxi Shangshi Electronic Technol. Co., Ltd., Wuxi,214000, China
来源：
Gongcheng Kexue Yu Jishu/Advanced Engineering Sciences | 2024年 / 56卷 / 05期
关键词：
D O I：
10.15961/j.jsuese.202201338
中图分类号：
学科分类号：
摘要：
Chip scale packages
引用
收藏
页码：277 / 286
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