Processing Method for Metallic Substrate Using the Liquid Metal Lapping-Polishing Plate

被引：0
|
作者：
Ji, Renquan [1 ,2 ]
Zhang, Liyang [1 ,2 ]
Zhang, Li [1 ,2 ]
Li, Yanbiao [1 ,2 ]
Lu, Shasha [1 ,2 ]
Fu, Yufei [1 ,2 ]
机构：
[1] College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou, China
[2] Key Laboratory of Special Purpose Equipment and Advanced Processing Technology at Zhejiang, University of Technology, Ministry of Education, Hangzhou, China
来源：
Frontiers in Materials | 2022年 / 9卷
关键词：
Compendex;
D O I：
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中图分类号：
学科分类号：
摘要：
Temperature
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