A Hybrid Integrated and Low-Cost Multi-Chip Broadband Doherty Power Amplifier Module for 5G Massive MIMO Application

被引：0
|
作者：
Huang, Fei [1 ]
Lv, Guansheng [1 ]
Wu, Huibo [1 ]
Chen, Wenhua [1 ]
Feng, Zhenghe [1 ]
机构：
[1] Department of Electronic Engineering, Tsinghua University, Beijing,100084, China
来源：
Engineering | / 38卷
关键词：
Compilation and indexing terms; Copyright 2025 Elsevier Inc;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
5G mobile communication systems - Bandwidth - Broadband amplifiers - Costs - Gallium nitride - III-V semiconductors - Microprocessor chips - MIMO systems - Peak to average power ratio
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页码：223 / 232
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