Assembly technology of electronic components for e-textiles

被引：0
|
作者：
Blecha T. [1 ]
Hirman M. [1 ]
Navratil J. [1 ]
机构：
[1] Department of Materials and Technology, Faculty of Electrical Engineering, University of West Bohemia in Pilsen, Univerzitni 8, Pilsen
来源：
Power Electronic Devices and Components | 2024年 / 7卷
关键词：
Contact resistance; E-textile; Non-conductive adhesive; SMD assembly technology; UV-curable adhesive;
D O I：
10.1016/j.pedc.2024.100056
中图分类号：
学科分类号：
摘要：
This article deals with the issue of assembling conventional SMD components on textile substrates using UV-curable non-conductive adhesives. This technology is easily applicable in the textile industry. It thus enables the easy and fast production of e-textiles that are equipped with conventional electronic components or even entire electronic modules. The article describes the principle of this innovative technology. Furthermore, comprehensive results of testing the effect of mechanical stress, chemical cleaning, and climatic changes on e-textiles with assembled SMD components on the change in contact resistance are presented here. The results show that this technology can be used for assembling and encapsulating SMD components on a textile substrate in the realization of e-textiles. © 2024 The Author(s)
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