Interfacial Reaction between Silver and Solid Indium

被引：0
|
作者：
Fang, I.C. [1 ]
Chang, F.L. [1 ]
Chang, C.C. [1 ]
Kao, C.R. [1 ]
机构：
[1] National Taiwan University, Department of Materials Science and Engineering, Taipei, Taiwan
来源：
2023 International Conference on Electronics Packaging, ICEP 2023 | 2023年
关键词：
Compilation and indexing terms; Copyright 2024 Elsevier Inc;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Binary alloys - Electronics packaging - Growth rate - Indium - Reaction kinetics - Silver - Silver alloys
引用
收藏
页码：207 / 208
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