Interfacial Reaction between Silver and Solid Indium

被引:0
|
作者
Fang, I.C. [1 ]
Chang, F.L. [1 ]
Chang, C.C. [1 ]
Kao, C.R. [1 ]
机构
[1] National Taiwan University, Department of Materials Science and Engineering, Taipei, Taiwan
关键词
Compilation and indexing terms; Copyright 2024 Elsevier Inc;
D O I
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中图分类号
学科分类号
摘要
Binary alloys - Electronics packaging - Growth rate - Indium - Reaction kinetics - Silver - Silver alloys
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页码:207 / 208
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