Experimental and simulation research on removal mechanism of precision machining SiCp/Al composites based on multi-phase simulation model

被引：1
|
作者：
Du, Yongsheng [1 ,2 ]
Lu, Mingming [1 ,2 ]
Lin, Jieqiong [1 ,2 ]
Li, Yucheng [1 ,2 ]
Zhou, Xiaoqin [3 ]
机构：
[1] Changchun Univ Technol, Sch Mechatron Engn, Jilin Prov Key Lab Micronano & Ultraprecis Mfg, Yanan Ave 2055, Changchun 130012, Jilin, Peoples R China
[2] Changchun Univ Technol, Jilin Prov Key Lab Int Sci & Technol Cooperat High, Sch Mechatron Engn, Yanan Ave 2055, Changchun 130012, Jilin, Peoples R China
[3] Jilin Univ, Sch Mech & Aerosp Engn, Changchun 130022, Peoples R China
来源：
ALEXANDRIA ENGINEERING JOURNAL | 2024年 / 109卷
关键词：
SiCp/Al composite material; Finite element simulation; Precision machining; Removal mechanism; Particle deformation; CHIP FORMATION; CUTTING MECHANISM; TOOL WEAR; MATRIX; MACHINABILITY; PARTICLES;
D O I：
10.1016/j.aej.2024.08.110
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Because of their exceptional material qualities, SiCp/Al composites are widely used in significant engineering applications. The processability of SiCp/Al composites is frequently determined by the type of SiC particle removal. This paper examines the material properties of the matrix, reinforcing phase, and matrix-particle interface in detail. To simulate and analyze the microscopic removal mechanism of SiCp/Al composites, a more realistic multiphase two-dimensional microscopic finite element model is established. In terms of chip production, cutting force, and surface morphology, related orthogonal cutting experiments confirmed the validity and correctness of the finite element model. Furthermore, the unique material removal mechanism of SiCp/ Al composites is disclosed, and the cause of the oscillation phenomena of the surface roughness value under various cutting settings is explained by analyzing the various removal procedures of SiC particles. Theoretical support and an experimental foundation are offered for the precise machining of SiCp/Al composite materials.
引用
收藏
页码：482 / 496
页数：15
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