Sn-based solder design using machine learning approach

被引：0
|
作者：
Liu, Yu-Chen [1 ,2 ]
Yang, Chih-Han [1 ]
Lin, Shih-Kang [1 ,2 ]
机构：
[1] National Cheng Kung University, Department of Materials Science and Engineering, Taiwan
[2] National Cheng Kung University, Hierarchical Green-Energy Materials (Hi-GEM) Research Center, Tainan City,70101, Taiwan
来源：
2022 International Conference on Electronics Packaging, ICEP 2022 | 2022年
关键词：
Compilation and indexing terms; Copyright 2024 Elsevier Inc;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Drops - Electronics packaging - Machine learning
引用
收藏
页码：43 / 44
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