Effect of ANSA as an additive on electrodeposited Sn-Ag-Cu alloy coatings in deep eutectic solvent

被引：0
|
作者：
Wu, Qihu [1 ]
Huang, Jiacheng [1 ]
Wang, Wenchang [1 ]
Ming, Zhiyao [1 ]
Wu, Minxian [1 ]
Qin, Shuiping [2 ]
Wang, Pengju [3 ]
Mitsuzaki, Naotoshi [2 ]
Chen, Zhidong [1 ]
机构：
[1] Changzhou University, School of Petrochemical Engineering, Changzhou,213164, China
[2] Qualtec Materials Technology (Changzhou) Co., Ltd., Changzhou,213164, China
[3] Jiangsu Mingfeng Electronics& Material Technology Co., Ltd., Changzhou,213164, China
来源：
Journal of Molecular Liquids | 2024年 / 414卷
关键词：
Compendex;
D O I：
10.1016/j.molliq.2024.126161
中图分类号：
学科分类号：
摘要：
Calcium alloys - Chlorine compounds - Copper alloys - Electrodeposition
引用
收藏
相关论文
共 50 条
  • [1] Effect of deposition potential on electrodeposition of Sn-Ag-Cu ternary alloy solderable coating in deep eutectic solvent
    Huang, Jiacheng
    Wang, Wenchang
    Xiang, Qian
    Qin, Shuiping
    Wang, Pengju
    Mitsuzaki, Naotoshi
    Chen, Zhidong
    JOURNAL OF ELECTROANALYTICAL CHEMISTRY, 2023, 943
  • [2] The microstructure parameters and microhardness of directionally solidified Sn-Ag-Cu eutectic alloy
    Boyuk, U.
    Marasli, N.
    JOURNAL OF ALLOYS AND COMPOUNDS, 2009, 485 (1-2) : 264 - 269
  • [3] Accurately determining eutectic compositions: The Sn-Ag-Cu ternary eutectic
    Moon, KW
    Boettinger, WJ
    JOM, 2004, 56 (04) : 22 - 27
  • [4] The solid solubility of Ag and Cu in the Sn phase of eutectic and near-eutectic Sn-Ag-Cu solder alloys
    Snugovsky, L
    Cermignani, C
    Perovic, DD
    Rutter, JW
    JOURNAL OF ELECTRONIC MATERIALS, 2004, 33 (11) : 1313 - 1315
  • [5] Accurately determining eutectic compositions: The Sn-Ag-Cu ternary eutectic
    K. -W. Moon
    W. J. Boettinger
    JOM, 2004, 56 : 22 - 27
  • [6] The solid solubility of Ag and Cu in the Sn phase of eutectic and near-eutectic Sn-Ag-Cu solder alloys
    L. Snugovsky
    C. Cermignani
    D. D. Perovic
    J. W. Rutter
    Journal of Electronic Materials, 2004, 33 : 1313 - 1315
  • [7] Formation Mechanism of Eutectic Cu6Sn5 and Ag3Sn after Growth of Primary β-Sn in Sn-Ag-Cu Alloy
    Takamatsu, Yoshiko
    Esaka, Hisao
    Shinozuka, Kei
    MATERIALS TRANSACTIONS, 2011, 52 (02) : 189 - 195
  • [8] Effect of Different Aging Times on Sn-Ag-Cu Solder Alloy
    Efzan, Ervina M. N.
    Norfarhani, Siti, I
    TRANSACTIONS ON ELECTRICAL AND ELECTRONIC MATERIALS, 2015, 16 (03) : 112 - 116
  • [9] Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu
    Kim, KS
    Huh, SH
    Suganuma, K
    MICROELECTRONICS RELIABILITY, 2003, 43 (02) : 259 - 267
  • [10] Electrochemical corrosion behaviour of Sn-Ag-Cu (SAC) eutectic alloy in a chloride containing environment
    Rosalbino, F.
    Zanicchi, G.
    Carlini, R.
    Angelini, E.
    Marazza, R.
    MATERIALS AND CORROSION-WERKSTOFFE UND KORROSION, 2012, 63 (06): : 492 - 496
12345