Time-resolved Spectroscopy of Glass Ablation during Micro-via Processing using 248 nm Excimer Laser for Semiconductor Interposer Packaging

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Gigaphoton Inc., 400 Yokokura shinden, Tochigi,Oyama-shi ^{[1
]}

323-8558, Japan

不详 ^{[2
]}

169-8558, Japan

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J. Laser Micro Nanoeng. | / 3卷 / 133-140期

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[25] Rapid and complex dynamics of through glass via formation using a picosecond quasi-continuous wave laser as revealed by time-resolved absorptance measurements and multiphase modeling
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