Precision Cleaning Technology for Advanced Package

被引:0
|
作者
Yamada, Kouhei [1 ]
Cheng, Ching teng [1 ]
Kouke, Atsushi [1 ]
Nishi, Isao [1 ]
机构
[1] Kao Corporation R&D – Performance Chemicals Research, 1334 Minato, Wakayama, Wakayama,640-8580, Japan
关键词
D O I
10.5104/jiep.27.484
中图分类号
学科分类号
摘要
引用
收藏
页码:484 / 490
相关论文
共 50 条
  • [2] Advanced SiC Power Technology and Package
    Kim, ByongJin
    Bolotnikov, Alexander
    Jeong, Helen
    Kim, Chandong
    Das, Hrishkesh
    Ponram, Ganesh
    2023 7TH IEEE ELECTRON DEVICES TECHNOLOGY & MANUFACTURING CONFERENCE, EDTM, 2023,
  • [3] Advanced Flip Chip Package on Package Technology for Mobile Applications
    Hsieh, Ming-Che
    2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2016, : 486 - 491
  • [4] Advanced engineering ceramics for semiconductor package technology
    Kim, Hee Seung
    Seo, Mi Young
    Kim, Ik Jin
    High-Performance Ceramics IV, Pts 1-3, 2007, 336-338 : 1155 - 1158
  • [5] Cleaning Challenges and Solutions for Advanced Technology Nodes
    Mertens, P. W.
    Vos, R.
    Masayuki, W.
    Arnauts, S.
    Takahashi, H.
    Tsvetanova, D.
    Cuypers, D.
    Sioncke, S.
    Valckx, N.
    Brems, S.
    Hauptmann, M.
    Heyns, M.
    SEMICONDUCTOR CLEANING SCIENCE AND TECHNOLOGY 12 (SCST 12), 2011, 41 (05): : 3 - 13
  • [6] Advanced Technology Dispels Membrane Cleaning Myths
    Lee, Durham
    Opflow, 2014, 40 (02) : 10 - 13
  • [8] Research on the Cleaning Technology of Sapphire Substrates Precision Process for LED
    Zhou Hai
    Bei Ligang
    Zang Yue
    Xu Xiaoming
    Zuo Ziguo
    MANAGEMENT, MANUFACTURING AND MATERIALS ENGINEERING, PTS 1 AND 2, 2012, 452-453 : 1415 - 1419
  • [9] Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology
    Kar, Yap Boon
    Talik, Noor Azrina
    Sauli, Zaliman
    Seng, Foong Chee
    Yong, Tan Chou
    Retnasamy, Vithyacharan
    MICROELECTRONICS INTERNATIONAL, 2013, 30 (02) : 99 - 103
  • [10] Advanced Package Wiring Technology Solution for Heterogeneous Integration
    Morikawa, Yasuhiro
    2019 PAN PACIFIC MICROELECTRONICS SYMPOSIUM (PAN PACIFIC), 2019,