Acoustic wave devices based on piezoelectric/ferroelectric thin films for high-frequency communication systems and sensing applications

被引:2
|
作者
Xue, Yanmei [1 ]
Liu, Yuan [1 ]
Zhou, Changjian [2 ]
Zhang, Xiu Yin [3 ]
机构
[1] Guangdong Univ Technol, Sch Integrated Circuits, Guangzhou 510006, Guangdong, Peoples R China
[2] South China Univ Technol, Sch Microelect, Guangzhou 510640, Guangdong, Peoples R China
[3] South China Univ Technol, Sch Elect & Informat Engn, Guangzhou 510641, Peoples R China
基金
中国国家自然科学基金;
关键词
Acoustic device; Surface acoustic wave (SAW); Bulk acoustic wave (BAW); RF wireless communication; Single crystal; Ferroelectric material; Flexible electronic devices; RESONATOR; LINBO3; LITAO3;
D O I
10.1016/j.ceramint.2024.03.212
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Surface acoustic wave (SAW) and bulk acoustic wave (BAW) based radio-frequency (RF) filters dominate in handsets markets mainly because they have miniature size so multiple filters can be used but take up very small board area. Besides, due to their inherent advantages, such as low insertion loss, relatively high resonant frequency, and miniature size, their application in the physical and biochemical sensing fields has also gradually expanded. The successful implementation requires specific knowledge of acoustic wave properties, the working mechanisms, material properties, and device design. So, in this review, we survey the SAW and BAW filter technology by discussing the working principles and the comparison between the operation frequency band allocations. In addition, the approaches to enhance the performance including the selection of single crystal/ ferroelectric materials for BAW and the structure design optimization for SAW are introduced with discussions for further improvement. Then, flexible SAW and BAW devices are also presented and their new application opportunities in the fields of skin-like electronics and wearable health monitoring devices can be foreseen. Finally, the potential challenges of high frequency, wide bandwidth, miniaturization, and compatibility with the integrated circuits (IC) manufacturing process are overviewed as well.
引用
收藏
页码:52051 / 52058
页数:8
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