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- [2] Reliability of Palladium Coated Copper Wire 2010 12TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2010, : 343 - 348
- [3] Behaviors of Palladium in Palladium Coated Copper Wire Bonding Process 2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009), 2009, : 586 - +
- [4] INCREASING PACKAGE ROBUSTNESS WITH PALLADIUM COATED COPPER WIRE 2016 IEEE 37TH INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY (IEMT) & 18TH ELECTRONICS MATERIALS AND PACKAGING (EMAP) CONFERENCE, 2016,
- [5] Bare Copper and Palladium Coated Copper Wire Chip to Chip Bonding Feasibility Study PROCEEDINGS OF THE 2013 IEEE 15TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2013), 2013, : 183 - 188
- [7] Copper versus Palladium Coated Copper Wire Process and Reliability Differences 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2014, : 1539 - 1548
- [8] TEM study on interface of palladium coated copper wire bonding on aluminum metallization 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 339 - 344
- [10] Palladium-coated and Bare Copper Wire Study for Ultra-Fine Pitch Wire Bonding CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2013 (CSTIC 2013), 2013, 52 (01): : 717 - 730