Experimental study on spheroidal morphology of palladium coated copper wire with different palladium layer thickness

被引:0
|
作者
An, Bin [1 ]
Zhou, Hongliang [1 ,2 ]
Cao, Jun [1 ,2 ]
Ming, Pingmei [1 ,2 ]
Xia, Jie [1 ]
Yao, Jingguang [1 ]
Persic, John [1 ,3 ]
Zhang, Yuemin [1 ,2 ]
机构
[1] Henan Polytech Univ, Sch Mech & Power Engn, Jiaozuo 454003, Peoples R China
[2] Henan Polytech Univ, Henan Int Joint Lab Adv Elect Packaging Mat Precis, Jiaozuo 454003, Peoples R China
[3] Microbonds Inc, 7495 Birchmount Rd, Markham, ON L3R 5G2, Canada
来源
APL MATERIALS | 2024年 / 12卷 / 10期
基金
中国国家自然科学基金;
关键词
CORROSION BEHAVIOR; CU; RELIABILITY; MECHANISM; AL;
D O I
10.1063/5.0232025
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Palladium (Pd) coated copper (PCC) wire is an emerging bonding wire that has been widely researched. In this paper, the effects of electronic flame-off (EFO) current and EFO time on the free air ball (FAB) morphology of four PCC wires with Pd layer thicknesses of 60, 80, 100, and 120 nm, respectively, are first investigated. The larger the EFO current or the longer the EFO time, the larger the FAB diameter. The EFO time or EFO current setting is either too high or too low to form a FAB with good morphology. Taking the ratio of FAB diameter to wire diameter as 2 as the standard, the EFO current of 48 mA and the EFO time of 700 mu s are selected as the optimal EFO parameter combination. Under this parameter combination, the symmetry, roundness, and surface smoothness of the FAB of the four PCC wires are all at a better level. It is found that the FAB surface Pd coverage of PCC wire with 120 nm Pd layer thickness is higher through the corrosion test. The Pd transfer law on the FAB at different EFO times under optimal EFO current is also studied. The results show that with the prolongation of the EFO time, the Pd on the FAB surface is gradually transferred from the neck to the middle and lower parts. This study can provide technical reference for the selection of Pd layer thickness and EFO parameters of PCC wire. (c) 2024 Author(s).
引用
收藏
页数:13
相关论文
共 50 条
  • [1] Simulation study on the effect of palladium layer thickness and temperature on the bonding properties of palladium coated copper wire
    An, Bin
    Zhou, Hongliang
    Cao, Jun
    Ming, Pingmei
    Xia, Jie
    Yao, Jingguang
    Persic, John
    MICROELECTRONICS RELIABILITY, 2024, 162
  • [2] Reliability of Palladium Coated Copper Wire
    Stephan, Dominik
    Wulff, Frank W.
    Milke, Eugen
    2010 12TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2010, : 343 - 348
  • [3] Behaviors of Palladium in Palladium Coated Copper Wire Bonding Process
    Zhang, Binhai
    Qian, Kaiyou
    Wang, Ted
    Cong, Yuqi
    Zhao, Mike
    Fan, Xiangquan
    Wang, Jiaji
    2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009), 2009, : 586 - +
  • [4] INCREASING PACKAGE ROBUSTNESS WITH PALLADIUM COATED COPPER WIRE
    Melanio, Rodan A.
    Cervantes, Regine B.
    Dipasupil, Sonny E.
    2016 IEEE 37TH INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY (IEMT) & 18TH ELECTRONICS MATERIALS AND PACKAGING (EMAP) CONFERENCE, 2016,
  • [5] Bare Copper and Palladium Coated Copper Wire Chip to Chip Bonding Feasibility Study
    Ho, Ong Chen
    Ying, Lee Chai
    Se, Gan Pei
    PROCEEDINGS OF THE 2013 IEEE 15TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2013), 2013, : 183 - 188
  • [6] A Study of the Sulfidation Behavior on Palladium-Coated Copper Wire with a Flash-Gold Layer (PCA) after Wire Bonding
    Chen, Kuan-Jen
    Hung, Fei-Yi
    Chang, Chia-Yun
    ELECTRONICS, 2019, 8 (07)
  • [7] Copper versus Palladium Coated Copper Wire Process and Reliability Differences
    Lee, Chu-Chung
    TuAnh Tran
    Boyne, Dan
    Higgins, Leo
    Mawer, Andrew
    2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2014, : 1539 - 1548
  • [8] TEM study on interface of palladium coated copper wire bonding on aluminum metallization
    Xu, Hui
    Qin, Ivy
    Shah, Ashish
    Clauberg, Horst
    Chylak, Bob
    Acoff, Viola L.
    2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 339 - 344
  • [9] High temperature storage reliability of palladium coated copper wire in different EFO current settings
    Cheng, Pi-Ying
    Lai, Po-Ying
    Ye, Jiun-Ming
    Chen, Tsung-Chia
    Hsieh, Cheng-Li
    MICROELECTRONICS RELIABILITY, 2018, 80 : 1 - 6
  • [10] Palladium-coated and Bare Copper Wire Study for Ultra-Fine Pitch Wire Bonding
    Lim, A. B. Y.
    Chang, A. C. K.
    Lee, C. X.
    Yauw, O.
    Chylak, B.
    Chen, Z.
    CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2013 (CSTIC 2013), 2013, 52 (01): : 717 - 730