Roadmap on printable electronic materials for next-generation sensors

被引:4
|
作者
Pecunia, Vincenzo [1 ]
Petti, Luisa [2 ]
Andrews, Joseph B. [3 ,4 ]
Ollearo, Riccardo [5 ,6 ]
Gelinck, Gerwin H. [5 ,6 ]
Nasrollahi, Bahareh [1 ]
Jailani, Javith Mohammed [1 ]
Li, Ning [7 ]
Kim, Jong H. [8 ]
Ng, Tse Nga [9 ]
Feng, Hanru [10 ]
Chen, Zhizhou [10 ]
Guo, Yupeng [11 ]
Shen, Liang [10 ]
Lhuillier, Emmanuel [12 ]
Kuo, Lidia [13 ]
Sangwan, Vinod K. [13 ]
Hersam, Mark C. [13 ]
Fraboni, Beatrice [14 ]
Basiricò, Laura [14 ]
Ciavatti, Andrea [14 ]
Wu, Haodi [15 ]
Niu, Guangda [16 ]
Tang, Jiang [15 ,16 ]
Yang, Ge [17 ]
Kim, Doup [17 ]
Dremann, Derek [18 ]
Jurchescu, Oana D. [18 ]
Bederak, Dmytro [19 ]
Shulga, Artem G. [19 ]
Costa, Pedro [20 ]
Perinka, Nikola [21 ]
Lanceros-Mendez, Senentxu [20 ,21 ,22 ]
Chortos, Alex [23 ]
Khuje, Saurabh [24 ]
Yu, Jian [25 ]
Ren, Shenqiang [24 ]
Mascia, Antonello [26 ]
Concas, Mattia [26 ]
Cosseddu, Piero [26 ]
Young, Robert J. [27 ]
Yokota, Tomoyuki [28 ]
Somoya, Takeo [28 ]
Jeon, Sung Jae [29 ]
Zhao, Naixin [29 ]
Li, Yuning [29 ]
Shukla, Darpan [30 ]
Wu, Shuang [30 ]
Zhu, Yong [30 ]
Takei, Kuniharu [31 ]
机构
[1] School of Sustainable Energy Engineering, Simon Fraser University, Surrey,BC,V3T 0N1, Canada
[2] Faculty of Engineering, Free University of Bozen-Bolzano, Bolzano, Italy
[3] Department of Mechanical Engineering, University of Wisconsin—Madison, Madison,WI,53716, United States
[4] Department of Electrical and Computer Engineering, University of Wisconsin—Madison, Madison,WI,53716, United States
[5] Eindhoven University of Technology, Eindhoven, Netherlands
[6] TNO/Holst Centre, Eindhoven, Netherlands
[7] School of Electronic and Optical Engineering, Nanjing University of Science and Technology, Nanjing, China
[8] Department of Molecular Science and Technology, Ajou University, Suwon-si, Korea, Republic of
[9] Department of Electrical and Computer Engineering, University of California San Diego, San Diego,CA, United States
[10] State Key Laboratory of Integrated Optoelectronics, College of Electronic Science and Engineering, International Center of Future Science, Jilin University, Changchun, China
[11] College of Chemistry, Jilin University, Changchun, China
[12] Sorbonne Université, CNRS, Institut des NanoSciences de Paris, INSP, Paris,F-75005, France
[13] Department of Materials Science and Engineering, Northwestern University, Evanston,IL,60208, United States
[14] Department of Physics and Astronomy, University of Bologna, Viale C. Berti Pichat 6/2, Bologna,40127, Italy
[15] Wuhan National Laboratory for Optoelectronics, School of Optical and Electronic Information, Huazhong University of Science and Technology, Hubei Province, Wuhan,430074, China
[16] Optics Valley Laboratory, Hubei Province, Wuhan,430074, China
[17] Department of Nuclear Engineering, North Carolina State University, 2500 Stinson Drive, Raleigh,NC,27695-7909, United States
[18] Department of Physics, Center for Functional Materials, Wake Forest University, Winston Salem,NC,27109, United States
[19] QDI systems B.V, L.J. Zielstraweg 1, Groningen,9713 GX, Netherlands
[20] Physics Centre of Minho, Porto Universities (CF-UM-UP), Laboratory of Physics for Materials and Emergent Technologies, LapMET, University of Minho, Braga,4710-053, Portugal
[21] BCMaterials, Basque Center for Materials, Applications and Nanostructures, UPV/EHU Science Park, Leioa,48940, Spain
[22] IKERBASQUE, Basque Foundation for Science, Bilbao,48009, Spain
[23] Purdue University, West Lafayette,IN,47907, United States
[24] Department of Materials Science and Engineering, University of Maryland, College Park,MD,20742, United States
[25] DEVCOM Army Research Laboratory, Aberdeen Proving Ground,MD,21005, United States
[26] Department of Electrical and Electronic Engineering, University of Cagliari, Piazza d’Armi, Cagliari,09123, Italy
[27] National Graphene Institute, the Department of Materials, University of Manchester, Manchester,M13 9PL, United Kingdom
[28] Department of Electric and Electronic Engineering, The University of Tokyo, Tokyo, Japan
[29] Department of Chemical Engineering, Waterloo Institute for Nanotechnology (WIN), University of Waterloo, 200 University Ave West, Waterloo,ON,N2L 3G1, Canada
[30] Department of Mechanical and Aerospace Engineering, North Carolina State University, Raleigh,NC,27695, United States
[31] Graduate School of Information Science and Technology, Hokkaido University, Sapporo,060-0814, Japan
[32] Institute of Condensed Matter and Nanosciences, Université catholique de Louvain (UCLouvain), Louvain-la-Neuve,1348, Belgium
[33] Department of Chemical Engineering, The University of Manchester, Manchester,M13 9PL, United Kingdom
[34] Department of Electronic Engineering, Universitat Rovira i Virgili, Avda. Països Catalans, 26, Tarragona, Catalonia,43007, Spain
[35] Department of Information Engineering, University of Brescia, UdR INSTM of Brescia, via Branze 38, Brescia, Italy
[36] Cambridge Graphene Centre, Department of Engineering, University of Cambridge, 9 J J Thomson Avenue, Cambridge,CB3 0FA, United Kingdom
[37] Nanotechnology Research Laboratory, Research School of Chemistry, College of Science, Australian National University, Canberra,ACT,2601, Australia
[38] Research School of Physics, Australian National University, Canberra,ACT,2601, Australia
[39] Nanotechnology Research Laboratory, Faculty of Engineering, University of Sydney, Sydney,NSW,2006, Australia
[40] Department Electronics and Computer Technology, University of Granada, Granada, Spain
[41] Department Inorganic Chemistry, University of Granada, Granada, Spain
[42] MNF—Micro Nano Facility, Sensors and Devices Center, Bruno Kessler Foundation, Via Sommarive 18, Trento,38123, Italy
[43] Department of Physics and Earth Sciences, University of Ferrara, Via Saragat 1, Ferrara,44122, Italy
[44] Université Paris Cité, ITODYS, CNRS, Paris,F-75006, France
[45] University of Colorado Boulder, College of Engineering and Applied Science, 4001 Discovery Drive, Boulder,CO,80303, United States
[46] Department of Pharmacy, University of Naples ‘Federico II’, Via Domenico Montesano 49, Naples,80131, Italy
[47] Department of Electrical and Electronic Engineering, School of Engineering, University of Manchester, Manchester,M13 9PL, United Kingdom
[48] Centre for Process Innovation, Sedgefield,TS21 3FG, United Kingdom
[49] School of Engineering, University of Kent, Kent,CT2 7NZ, United Kingdom
[50] Department of Chemistry, School of Natural Sciences, University of Manchester, Manchester,M13 9PL, United Kingdom
基金
美国国家卫生研究院; 美国食品与农业研究所; 新加坡国家研究基金会;
关键词
Electromagnetic pulse - Protective coatings - Rolls (machine components) - Smart sensors - X ray diffraction;
D O I
10.1088/2399-1984/ad36ff
中图分类号
学科分类号
摘要
The dissemination of sensors is key to realizing a sustainable, ‘intelligent’ world, where everyday objects and environments are equipped with sensing capabilities to advance the sustainability and quality of our lives—e.g. via smart homes, smart cities, smart healthcare, smart logistics, Industry 4.0, and precision agriculture. The realization of the full potential of these applications critically depends on the availability of easy-to-make, low-cost sensor technologies. Sensors based on printable electronic materials offer the ideal platform: they can be fabricated through simple methods (e.g. printing and coating) and are compatible with high-throughput roll-to-roll processing. Moreover, printable electronic materials often allow the fabrication of sensors on flexible/stretchable/biodegradable substrates, thereby enabling the deployment of sensors in unconventional settings. Fulfilling the promise of printable electronic materials for sensing will require materials and device innovations to enhance their ability to transduce external stimuli—light, ionizing radiation, pressure, strain, force, temperature, gas, vapours, humidity, and other chemical and biological analytes. This Roadmap brings together the viewpoints of experts in various printable sensing materials—and devices thereof—to provide insights into the status and outlook of the field. Alongside recent materials and device innovations, the roadmap discusses the key outstanding challenges pertaining to each printable sensing technology. Finally, the Roadmap points to promising directions to overcome these challenges and thus enable ubiquitous sensing for a sustainable, ‘intelligent’ world. © 2024 The Author(s). Published by IOP Publishing Ltd.
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