Compensation of the Warpage of CVD Diamond Wafers using Intermediate Layers for Surface Activated Bonding

被引：0
|
作者：
Wang, Junsha [1 ]
Suga, Tadatomo [1 ]
机构：
[1] Meisei University, Collaborative Research Center, Tokyo,1918506, Japan
来源：
2023 International Conference on Electronics Packaging, ICEP 2023 | 2023年
关键词：
Compendex;
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摘要：
Silica
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页码：169 / 170
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